In general, IC testing mainly includes chip pin continuity test, leakage current test, some DC (directcurrent) test, functional test (functionaltest), Trimtest, depending on the chip type, there are some other tests, such as AD/DA. There will be some special test types.

The purpose of the chip test is to find the chip that is not problematic while trying to save costs. Therefore, the type of defect that is easy to detect or relatively common will be detected first. In general, the first thing you will do is the continuity test, which we call continuitytest. This is to check if the connectivity of each pin is normal.

The chip test is generally divided into the final test and the wafer test from the test object, which refers to the already packaged chip and the chip that has not been packaged. Why do you want to divide it into two paragraphs? To put it simply, because the package is also cost-effective, in order to save the cost as much as possible, some tests may be performed before the chip package to eliminate some broken chips. In order to ensure that the chip is no problem, the final test, that is, the FT test is the last interception, and is also a necessary link. The final test package and chip development company will use the IC socket for FAT, Shenzhen Hongyi Electronics Co., Ltd., has many years of production and development experience. It has cooperated with a number of chip packaging and testing companies and chip development and design companies to provide various IC test sockets and IC test fixtures.

Shenzhen HongYi Electronics Co., Ltd. is mainly responsible for the overseas sales and international marketing of Kaizhitong products. It is a one-stop chip aging test solution manufacturer. If you want to know more about customized IC socket/fixture, please contact us:

Email:sales@andksocket.com

Skype:windy@hydz999.com