- [Company dynamic]What are the main functions of HongYi SSD solid state drive test bench?2018/07/16/ 16:17
- The SSD solid state drive test bench is used to test the solid state drive as the name implies. What are the main functions of this test socket?
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- [Case]CQFP84 function test socket2018/07/16/ 10:14
- Test chip: CQFP84 package (HFQ package) The main function of this model chip is: synchronous sampling of 24-bit analog-to-digital converters. The chip is used in military-grade applications, mainly for drilling equipment, high temperature e...
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- [Case]QFN32 15GHz high frequency test stand2018/07/16/ 10:06
- Cooperative product:QFN32 15GHz high frequency test stand Partner:Jiachi Microelectronics Co., Ltd. Cooperation details: Jiachi Microelectronics Co., Ltd. is a Xiamen integrated circuit design, software development, information system int...
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- [Industry news]HongYi talks about the characteristics of BGA socket2018/07/10/ 17:37
- The BGA socket is a package method in which the integrated circuit uses an organic carrier. So what are the advantages of this socket
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- [Industry news]HongYi talks about the use of burn-in test sockets2018/07/10/ 17:33
- The chip aging test stand is a semi-custom mechanized test stand with high performance, low cost and alternative injection molding aging test stand.
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- [Industry news]HongYi Electronics talks about how to solve the pain of the chip2018/07/10/ 17:30
- ZTE encountered a ban in the United States, and for a time in the Chinese industry, the whole people began to reflect on chips and focus on chips. We know that SMIC, Loongson and Vimicro are all well-known chip manufacturers in China. In re...
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- [Industry news]HongYi Electronics talks about the development trend of chip test equipment2018/07/10/ 17:20
- the chip inspection process is crucial, and the use of good chip test equipment and methods is one of the keys to improving the level of chip manufacturing.
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- [Company dynamic]HongYi talks about the characteristics of BGA socket2018/07/10/ 16:47
- BGA aging seat has various package forms, forming a family, which not only differ in size and I/O quantity, but also its physical structure. And packaging materials are also different.
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- [Company dynamic]What are the advantages of HongYi Electronic IC Test socket?2018/07/10/ 16:44
- The IC test socket (test socket) is a standard test equipment that tests the electrical performance and electrical connections of online components to check for manufacturing defects and component defects. So what are the advantages of Hong...
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- [Company dynamic]What are the characteristics of custom IC test sockets?2018/07/10/ 16:17
- Conventional IC test sockets companies have dedicated mold opening, but only for chips that correspond to one package parameter. If the pin and size of the IC to be tested change, it is often necessary to perform a custom IC test socket.
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- [FAQ]What materials does our socket use?2018/07/10/ 16:10
- A: It varies for test socket and burn-in socket. For details, please refer to the product description pages or HongYi product series pages.
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- [Company dynamic]customized IC socket process2018/07/10/ 15:30
- 1. Understand the package parameters and test requirements of the IC test socket corresponding to the customer's custom IC socket; 2. The sales staff will sort the customer's information and send it to the engineering evaluation department ...
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- [Company dynamic]Brief description of the BGA socket2018/07/10/ 15:20
- The BGA is a package in the IC that is typically used in memory chips to increase memory capacity by two to three times in the same volume. The BAG chip has a smaller volume, better heat dissipation and electrical performance than the TSOP ...
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