The chip aging test stand is a semi-custom mechanized test stand with high performance, low cost and alternative injection molding aging test stand. These reliable burn-in test sockets use a caliper cap with a floating Z-axis pressure plate to provide package thickness tolerance.
The aging test stand uses new high performance and innovative probe technology for 0.4 mm, 0.5 mm and larger pitch devices. Various types of chip test probes can be used for the test stand depending on the test requirements. The high performance test probe provides a maximum bandwidth of 30 GHz @ -1 db and a current capacity of 3.0 amps. Low cost test probes are available for DC aging applications. High-elastic spring test probes are available in lead-free packages.
The aging test socket is mainly used for aging, testing and screening of metal shell package integrated circuits. The metal pipe material is made of gold-plated phosphor bronze surface, silver plating, nickel plating, etc. The socket has high temperature resistance and good insulation performance. Durable and well received by users.
The aging test bench is widely used in aerospace, military, scientific research institutes, electronics, communication and integrated circuit manufacturing enterprises. It can be equipped with imported aging table, aging plate for device and high and low temperature test, aging screening for connection.
The QFN, SOP, QFP, BGA series of chip test aging seats produced by Shenzhen HongYi Electronics Co., Ltd. have been widely used in various industries and products, and are very mature, and meet various customer needs in many aspects. Welcome customers who need it. Order.HongYi contact information:
Email:sales@andksocket.com
Skype:windy@hydz999.com
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