HongYi talks about the characteristics of BGA socket

The BGA socket is a package method in which the integrated circuit uses an organic carrier. So what are the advantages of this socket?

• Compact design to increase the capacity of the aging test board;

• It adopts flip cover and spiral pressing structure, which is easy to operate;

• The structure of the pressure block is reasonable, the pressing speed is linear and controllable, the lower pressure is stable and balanced, and the force of the chip shell is evenly ensured;

• The tip of the probe is concave arc shape, which effectively supports the solder ball, which can ensure the contact performance is stable and protect the solder ball and the shape of the pad;

• Precise positioning slot and guide hole to ensure accurate IC positioning;

• Special IC carrier structure to protect the probe from external forces;

• Probe, copper-plated hard gold, with a service life of 100,000 times;

• Easy probe replacement and low maintenance costs;

• Use high strength and high temperature resistant insulation materials.

Shenzhen HongYi Electronics Co., Ltd. is mainly responsible for the overseas sales and international marketing of Kaizhitong products. It is a one-stop chip aging test solution manufacturer. If you want to know more about BGA socket, please contact us:

Email:sales@andksocket.com

Skype:windy@hydz999.com