Product introduction
-
1. Product use:Test block, the IC BGA221 chip test, data reading and writing -
2.Applicable package:BGA221 pin spacing 0.5mm -
3.Test stand:BGA221-0.5 -
4. Features: imported beryllium copper shrapnel, small resistance, good elasticity.
Specification size
-
1.model:BGA221-.5 -
2.Pin spacing (mm):0.5 -
3. Foot position: 65 -
4. Chip size: 11.5*13
Product Specification and Dimension :
| Application | data recovery burn-in test programming |
| Condition | New |
Product image
Navi pro3000s NAND
TSOP48-0.5-12X18.4 Open Top
TSOP54-0.8 IC Test Socket Chip Size 18x22mm
BGA132 BGA152 Burn in Socket BGA Adapter
BGA100-1.0 Burn in/programmer socket
eMCP529 BGA529 Pogo Pin Test Socket Reader
eMCP529 / BGA529 reader test socket
Analysis transform PCB board eMMC analysis
eMCP221 BGA221 Socket/adapter
High Quality eMCP221 Socket to USB