Focus on IC Test socket/burn-in socket for 18 yearsKZT ANDK HMILU

Characteristics of eMMC BGA 162/186

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  Analysis EMMC162 BGA186 high stable socket are as below:
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  1.Apply to different sizes of eMMC chip of Samsung, Sandisk, Micron,SK hynix etc.
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  2.Good quality Pogo pins were chosen for stable contact.
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  3.Materials of Popo pins: Barrel - phophated bronze Planger - Beryllium copper Spring - Piano wire
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  4.Easy use for different eMMC chip sizes by using suitable guide plate. Normally there are 4 sizes 11.5x13mm, 12x16mm, 12x18mm, 14x18mm.
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  5.Special PCB adapter for soldering.
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  6.Simple and quick fixing.
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  7.Layout of the test socket is LxWxH 34.55mmx28.8mmx30.3mm
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  8.Rating current: 0.5A.