Location:Home » Product Center » ANDK-program and burn in socket » BGA socket » BGA100-1.0 Burn in/programmer socket
Products
- > Customized IC socket/fixture
- > eMMC UFS test socket
- > ANDK-program and burn in socket
- > Crystal oscillator socket
- > DDR test solution
- > SSD test solution
- > FPC/FFC test solution
- > High frequency test socket
- > Auto test machine
- > Capacity burn in test socket
- > Pin Board
- > SSD and U disk flash test solution
Contact Us
- sales@andksocket.com
- +8618824309157
- GLUS, Liaokeng Road 05-1, Shiyan Street, Baoan District, Shenzhen, China
HOTLINE:+8618824309157
BGA100-1.0 Burn in/programmer socket
BGA100-1.0 OPEN TOP Burn in socket pin pitch 1.0mm IC size 14*18mm 12*18mm BGA100-1.0 BGA100 VFBGA100 burn in socket
Product Material & Performance:
-
1. socket Body: PEI -
2.Contacts:Beryllium Copper Alloy -
3.Contact Plating:Gold over Nickel -
4. Operation Force:2.0KG min, the more PINs the greater force. -
5.Contact Resistance:50mΩ max -
6. Dielectric:700V AC for 1 minute -
7. Insulation Resistance:1,000MΩ 700V DC -
8. Max Current Capacity : 1A -
9. Temperature Rating:-55℃~+175 ℃ -
10. Life Span 25,000 Times (Mechanical)
Product Specification and Dimension :
Type | BGA 100-1.0 Burn in/programmer socket |
Pin Pitch | 1.0mm |
Pin Count | 80 pins |
Applicable IC body size | 14*18mm 12*18mm |
Life Span | 25,000times |
Part number | BGA100(14*18mm 12*18mm)-1.0 socket |
IC Package | BGA 100 , VFBGA 100 |
Structure | OPEN-TOP |
Product image
Enquiry:BGA100-1.0 Burn in/programmer socket
- *Name:
- Tel:
- Company:
- *Email:
- Requirement:
- *code: