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BGA80 OPEN TOP burn in socket pitch 1.0mm
BGA80 OPEN TOP burn in socket pitch 1.0mm IC size 11*13mm BGA80(11x13)-1.0-TP01NT BGA80 VFBGA80 burn in programmer socket
Product Feature :
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1.Welding structure : Adopt traditional welding type to fix the socket and PCBA board , stable but waste time and effort , and once the socket is welded , it can’t be recycle ; -
2.No need of welding structure : Adopt innovative screws locking type to fix the sockets and PCBA board , ensure contact is stable , meantime shorten the assembly time , time-saving and reduce effort , and socket can be removed from the PCBA board , recycle and reduce test cost ;
Specification and Dimension
| Part number: | BGA80(11x13)-1.0-TP01NT |
| IC Package: | BGA 80, VFBGA 80 |
| Pin Pitch: | 1.0mm |
| Pin Count: | 80pins |
| IC Size: | 11*13mm |
| Structure: | OPEN-TOP |
| socket Body: | PEI |
| Contacts: | Beryllium Copper Alloy |
| Contact Plating: | Gold over Nickel |
| Operation Force: | 2.0KG min, the more PINs the greater force |
| Contact Resistance: | 50mΩ max |
| Dielectric: | 700V AC for 1 minute |
| Insulation Resistance: | 1,000MΩ 700V DC |
| Max Current Capacity: | 1A |
| Temperature Rating: | -55℃~+175 ℃ |
| Life Span 25,000 Times (Mechanical) | 1,000MΩ 700V DC |
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