Products
- > Customized IC socket/fixture
- > eMMC UFS test socket
- > ANDK-program and burn in socket
- > Crystal oscillator socket
- > DDR test solution
- > SSD test solution
- > FPC/FFC test solution
- > High frequency test socket
- > Auto test machine
- > Capacity burn in test socket
- > Pin Board
- > SSD and U disk flash test solution
Contact Us
- sales@andksocket.com
- +8618824309157
- GLUS, Liaokeng Road 05-1, Shiyan Street, Baoan District, Shenzhen, China
HOTLINE:+8618824309157
Characteristics of eMMC BGA 169 and 153
Analysis EMMC153 BGA169 socket without transforming PCB as the accessories of Analysis socket adapter
Product Specifications:
-
1.Apply to different sizes of eMMC chip of Samsung, Sandisk, Micron, etc. -
2.Good quality Pogo pins were chosen for stable contact. -
3. Materials of Popo pins: Barrel - phophated bronze Planger - Beryllium copper Spring - Piano wire -
4. Easy use for different eMMC chip sizes by using suitable guide plate. Normally there are 4 sizes 11.5x13mm, 12x16mm, 12x18mm, 14x18mm. -
5. Special PCB adapter for soldering. -
6. Simple and quick fixing. -
7. Layout of the test socket is LxWxH 34.55mmx28.8mmx30.3mm. -
8. Rating current: 0.5A.
Product image
Enquiry:Characteristics of eMMC BGA 169 and 153
- *Name:
- Tel:
- Company:
- *Email:
- Requirement:
- *code: