Focus on IC Test socket/burn-in socket for 18 yearsKZT ANDK HMILU

Product Feature :

• 
  Do not heat the stencil,this one is not for heating reball,it is an easy way to reball without heat!!!! Usage video,this is high-end product usage video,but the usage same http://v.youku.com/v_show/id_XNjgzMTI5MTg4.html?from=s1.8-1-1.2&spm=a2h0k.8191407.0.0 Usage: 1) put the tin solder paste through the stencil 1 T=0.12, remove the stencil 1 T=0.12 3) pour balls through stencil 2 T=0.15 4) remove the stencil 2 T=0.15 5) Weld the chip into your device
• 
  1.Use aluminium alloy as material , more portable , allow long time working without wrist fatigue
• 
  2.Mold core adopt high accuracy CNC machining , accurate IC location .
• 
  3.Steel mesh can reball four type chips meantime , more efficient .
• 
  4.Mold core adopts detachable design , easy to change through just two screws .
• 
  Our company also provide BGA rework one*stop service : BGA reballing , test , disassemble board , BGA mount etc .