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- +8618824309157
- GLUS, Liaokeng Road 05-1, Shiyan Street, Baoan District, Shenzhen, China
HOTLINE：+8618824309157
eMMC153/169 BGA153 BGA169
eMMC153/169 BGA153 BGA169 Burn in Socket Pin Pitch 0.5mm Test Socket Adapter
Product Features
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1.Apply to eMMC of Samsung , Sandis k , Toshiba , Hynix , Micron , HTC , MTK , Intel etc . -
2.Apply to BGA153 & BGA169 test -
3.eMMC data can be read and written fastly -
4. Accurate positioning on flat bottom pad and solder of eMMC -
5.Support flat bottom and solder ball testing . -
6. Technical support and datasheet are available if you need . -
7.we are the original manufacturer and welcome anyone to be our distribution agents -
8. Professional manufacturer in all kinds of IC chip testing sockets and adapters. -
9.More types of sockets and adapters for eMMC , eMCP , SOP , SSOP , TSSOP , QFP , QFN , BGA , SOT , MSOP , DFN and customize design , for customized socket and more product detail , please feel free to contact us .
Size limiters
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1.4 pcs / lot 11.5x13mm/12x16mm/12x18mm/14x18mm -
2.Single size 11.5x13mm -
3. Single size 12x16mm -
4.Single size 12x18mm -
5. Single size 14x18mm
Product Specification and Dimension :
| Type | Test & Burn in Socket ( without pcb ) |
| Pin Pitch | 0.5mm |
| Package | eMMC 153/169 , BGA 153/169 |
| Pin Count | 30 pins |
| eMMC thickness | 0.8mm - 1.5mm |
| Note | We provide 4 sizes for this adapter ( 11.5x13mm , 12x16mm , 12x18mm，14x18mm ) . |
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